Description: The problems of determining electronic equipment reliability indices were considered with the external mechanical influences - vibrations and hitting. Most failures of structural electronic devices design modules (cells and chips) are the destructions of electric components outputs and the solder joints. There are presented the methods of strength and endurance calculating of their outputs and solder joints. It was analyzed the possibility of the appearance of partial failures in these elements and their influence on the performance reliability of the entire device. There are illustrated results of creating model of vibration and hitting impact on indexes of cell reliability.
Keywords: radio-electronic device, vibrations, hitting, electrical contacts, soldered joints, reliability, partial failure